Field bindings
- Wafer hierarchy: Optional grouping hierarchy for wafers, lots, or other drill levels.
- Die X: Required. The X coordinate in XY mode, or the sequence/order field when Die Y is not bound.
- Die Y: Optional. When bound, Wafer Map renders true XY coordinates. When not bound, it uses X-only sequence mode.
- Die Value: Optional. Numeric values used to color dies. Multiple fields can be bound and swapped from the toolbar.
- Die Classification: Optional. Classification, bin, status, or pass/fail fields used for categorical coloring and yield metrics.
- Count: Optional measure. Bind this when your model may return rolled-up rows and you need to compare displayed rows with total die count.