Wafer and sequence layouts
Bind Die X and Die Y for a true 2D wafer map, or leave Die Y unbound for an X-only sequence grid.
Semiconductor analytics
Wafer Map for Power BI
Inspect die-level yield, failure patterns, bins, values, and process capability.
- Render true XY wafer maps or X-only sequence grids from Power BI fields
- Review pass/fail states, classifications, binned metrics, and numeric die values
- Compare wafers, distributions, yield signals, diagnostics, and process capability
Product preview
See the outcome
Browse example screens, then open any image for a closer look.
Capabilities
Purpose-built analysis without leaving the report
Wafer Map is a Power BI custom visual for semiconductor wafer maps, die value maps, bin maps, yield analysis, failure patterns, and process capability.
Multiple encodings
Visualize categorical classifications, binned metric ranges, or continuous numeric die values and switch among bound fields.
Hierarchy and drilldown
Use wafer, lot, station, batch, panel, or other hierarchy fields to organize and compare the current Power BI scope.
Engineering diagnostics
Review missing dies, duplicate coordinates, invalid rows, row limits, exclusions, and count mismatches directly in context.
Yield and distributions
Use summary statistics, legends, selection, wafer focus, and distribution views to investigate spatial patterns and yield loss.
Process capability
For numeric die values, enable limits and review Cp, Cpu, Cpl, and Cpk when enough valid data is available.
Typical workflows
Designed for real analytical work
- Probe and final-test yield review
- Wafer, lot, station, and batch comparison
- Bin-map and die-value inspection
- Edge effects, clusters, lines, random failures, and missing-die investigation
- Manufacturing quality and process-capability dashboards
Getting started
From installation to useful analysis
- 1
Prepare die-level tabular data before it reaches the visual.
- 2
Bind Die X as the required coordinate or sequence field.
- 3
Bind Die Y for a true 2D wafer map, or omit it for an X-only sequence grid.
- 4
Optionally bind Wafer hierarchy, Die Value, Die Classification, and Count fields.
- 5
Confirm Displayed Dies and Total Dies when using a count measure, then configure encoding, limits, and interaction settings.
Available now